Haseeb, A., Arafat, M., & Johan, M. (2012). Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds.
Chicago Style CitationHaseeb, A.S.M.A., M.M Arafat, and M.R Johan. Stability of Molybdenum Nanoparticles in Sn-3.8Ag-0.7Cu Solder During Multiple Reflow and Their Influence On Interfacial Intermetallic Compounds. 2012.
MLA CitationHaseeb, A.S.M.A., M.M Arafat, and M.R Johan. Stability of Molybdenum Nanoparticles in Sn-3.8Ag-0.7Cu Solder During Multiple Reflow and Their Influence On Interfacial Intermetallic Compounds. 2012.
Warning: These citations may not always be 100% accurate.