Effect of Reflow Profile on Intermetallic Compound Formation
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So f...
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| Format: | Artikel |
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IOP Publishing
2013
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| Capaian Atas Talian: | http://dx.doi.org/10.1016/j.clnme.2012.05.002 http://dx.doi.org/10.1016/j.clnme.2012.05.002 http://umpir.ump.edu.my/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf http://umpir.ump.edu.my/3549/2/1757-899X_46_1_012037_2.pdf |
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