APA Citation

Siti Rabiatull Aisha, I., Ali, O., & Y.T., C. (2012). Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper.

Chicago Style Citation

Siti Rabiatull Aisha, Idris, Ourdjini Ali, and Chin Y.T. Effect of Nickel Addition Into Sn-3Ag-0.5Cu On Intermetallic Compound Formation During Soldering On Copper. 2012.

MLA Citation

Siti Rabiatull Aisha, Idris, Ourdjini Ali, and Chin Y.T. Effect of Nickel Addition Into Sn-3Ag-0.5Cu On Intermetallic Compound Formation During Soldering On Copper. 2012.

Warning: These citations may not always be 100% accurate.