Laser micro welding of dissimilar material of aluminum and copper alloys
Copper and aluminum are widely used in electronic industries for their excellence in electric and thermal conductivity. Joining these different material in scale of micro is hardly difficult for their obvious different in thermal properties. Melting these materials during welding process will create...
à®®à¯à®´à¯ விளகà¯à®•à®®à¯
Saved in:
| தலைமை எழà¯à®¤à¯à®¤à®¾à®³à®°à¯à®•à®³à¯: | , , , , , |
|---|---|
| வடிவமà¯: | Conference or Workshop Item |
| வெளியீடபà¯à®ªà®Ÿà¯à®Ÿà®¤à¯: |
2016
|
| பகà¯à®¤à®¿à®•à®³à¯: | |
| நிகழà¯à®¨à®¿à®²à¯ˆ அணà¯à®•à®²à¯: | http://eprints.uthm.edu.my/8384/ http://eprints.uthm.edu.my/8384/1/8%2DT017.pdf |
| கà¯à®±à®¿à®¯à¯€à®Ÿà¯à®•à®³à¯: |
கà¯à®±à®¿à®šà¯à®šà¯Šà®²à¯ இணை
கà¯à®±à®¿à®¯à¯€à®Ÿà¯à®•à®³à¯ இலà¯à®²à¯ˆ, இநà¯à®¤ கà¯à®±à®¿à®šà¯à®šà¯Šà®²à¯à®²à¯ˆ à®®à¯à®¤à®²à®¿à®²à¯ பதிவ௠செயà¯à®¯à¯à®™à¯à®•à®³à¯!
|
| தொகà¯à®ªà¯à®ªà¯: | Copper and aluminum are widely used in electronic industries for their excellence in
electric and thermal conductivity. Joining these different material in scale of micro is hardly
difficult for their obvious different in thermal properties. Melting these materials during welding
process will create intermetallic compound which possesses new material properties. The melted
zone became extremely brittle thus increase the possibility of failure due to cracks and concentrated
loads. To overcome this problem, fundamental study is needed to characterize the material behavior
against heat induction under various processing parameters. This study is an attempt to characterize
the performance of Nd-YAG laser in micro joining of Al 1100 and Cu 101. |
|---|