APA Citation

Lai, Z. B., & Kamsah, N. (2008). Deformation and stresses in electronic package due to thermal cycling. Penerbit UTM.

Chicago Style Citation

Lai, Zheng Bo, and Nazri Kamsah. Deformation and Stresses in Electronic Package Due to Thermal Cycling. Penerbit UTM, 2008.

MLA Citation

Lai, Zheng Bo, and Nazri Kamsah. Deformation and Stresses in Electronic Package Due to Thermal Cycling. Penerbit UTM, 2008.

Warning: These citations may not always be 100% accurate.