APA Citation

Tan, C. L., Ourdjini, A., & Esah, H. (2006). Effect of reflow soldering and isothermal aging on interfacial microstructure between lead-free solder alloy and different surface finishes.

Chicago Style Citation

Tan, C. L., A. Ourdjini, and H. Esah. Effect of Reflow Soldering and Isothermal Aging On Interfacial Microstructure between Lead-free Solder Alloy and Different Surface Finishes. 2006.

MLA Citation

Tan, C. L., A. Ourdjini, and H. Esah. Effect of Reflow Soldering and Isothermal Aging On Interfacial Microstructure between Lead-free Solder Alloy and Different Surface Finishes. 2006.

Warning: These citations may not always be 100% accurate.