Kamsah, N., Tamin, M. N., Mohamed Kamar, H., Lahuri, H., & Wagiman, A. N. R. (2012). Development of vapor pressure in FR4-copper composite material during solder reflow process. American Institute of Physics.
Chicago Style CitationKamsah, Nazri, Mohd. Nasir Tamin, Haslinda Mohamed Kamar, Hidayatunnur Lahuri, and Amir Nur Rashid Wagiman. Development of Vapor Pressure in FR4-copper Composite Material During Solder Reflow Process. American Institute of Physics, 2012.
MLA CitationKamsah, Nazri, et al. Development of Vapor Pressure in FR4-copper Composite Material During Solder Reflow Process. American Institute of Physics, 2012.
Warning: These citations may not always be 100% accurate.