APA Citation

Beh , K. S. (2004). Substrate warpage analysis during solder reflow process.

Chicago Style Citation

Beh , Keh Shin. Substrate Warpage Analysis During Solder Reflow Process. 2004.

MLA Citation

Beh , Keh Shin. Substrate Warpage Analysis During Solder Reflow Process. 2004.

Warning: These citations may not always be 100% accurate.