Etching performance improvement on semiconductor silicon wafers with redesigned etching drum
Etching process involves various chemical reactions and reflects significantly on the silicon wafer quality. The paper addresses the major problem on wafers during etching that is wafer removal distribution throughout etching drum compartment. The etchant used in this study were the composition of H...
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| Pengarang-pengarang Utama: | , , |
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| Format: | Artikel |
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Penerbit UTM Press
2011
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| Capaian Atas Talian: | http://eprints.utm.my/44908/ http://eprints.utm.my/44908/ http://eprints.utm.my/44908/ |
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