Continuum damage evolution in pb-free solder joint under shear fatigue loadings
Progressive materials damage process in solder joint under cyclic shear deformation is examined in this study. A 3-D finite element model of a single reflowed SAC405 solder specimen is developed for this purpose. Cyclic relative displacement cycles between zero and 1.0 mm at displacement ramp r...
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| தலைமை எழà¯à®¤à¯à®¤à®¾à®³à®°à¯à®•à®³à¯: | , , , |
|---|---|
| வடிவமà¯: | Conference or Workshop Item |
| மொழி: | English |
| வெளியீடபà¯à®ªà®Ÿà¯à®Ÿà®¤à¯: |
2010
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| பகà¯à®¤à®¿à®•à®³à¯: | |
| நிகழà¯à®¨à®¿à®²à¯ˆ அணà¯à®•à®²à¯: | http://irep.iium.edu.my/39335/ http://irep.iium.edu.my/39335/1/EPTC_2010_Continuum_Damage_Evolution_in_Pb-Free_Solder_Joint_under_Shear_Fatigue_Loadings.pdf |
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