Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin
Tin-bismuth eutectic alloy (Sn-58 wt.% Bi) is emerging as a potential lead-free solder alternative. The low melting temperature (138oC) of this alloy makes it a suitable candidate for higher level interconnections and for soldering heat sensitive components. Demands for high density interconnections...
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| தலைமை எழà¯à®¤à¯à®¤à®¾à®³à®°à¯: | |
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| வடிவமà¯: | Thesis |
| வெளியீடபà¯à®ªà®Ÿà¯à®Ÿà®¤à¯: |
2015
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| பகà¯à®¤à®¿à®•à®³à¯: | |
| நிகழà¯à®¨à®¿à®²à¯ˆ அணà¯à®•à®²à¯: | http://studentsrepo.um.edu.my/7577/ http://studentsrepo.um.edu.my/7577/4/PhD_Thesis_Goh_Yingxin_KHA100056_Minor_Corrections.pdf |
| கà¯à®±à®¿à®¯à¯€à®Ÿà¯à®•à®³à¯: |
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