Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application
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| வடிவமà¯: | Non-Indexed Article |
| வெளியீடபà¯à®ªà®Ÿà¯à®Ÿà®¤à¯: |
Trans-Tech Publication
2012
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| நிகழà¯à®¨à®¿à®²à¯ˆ அணà¯à®•à®²à¯: | http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980 http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980 http://umkeprints.umk.edu.my/2263/1/AMR.626.980.pdf |
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