Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluat...
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| 格式: | Conference or Workshop Item |
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EDP Sciences
2016
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| 主题: | |
| 在线阅读: | http://dx.doi.org/10.1051/matecconf/20167400038 http://dx.doi.org/10.1051/matecconf/20167400038 http://umpir.ump.edu.my/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf http://umpir.ump.edu.my/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf |
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http://dx.doi.org/10.1051/matecconf/20167400038http://dx.doi.org/10.1051/matecconf/20167400038
http://umpir.ump.edu.my/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf
http://umpir.ump.edu.my/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf