Effect of Flux onto Intermetallic Compound Formation and Growth
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
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EDP Sciences
2016
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| Subjects: | |
| Online Access: | http://dx.doi.org/10.1051/matecconf/20167400034 http://dx.doi.org/10.1051/matecconf/20167400034 http://umpir.ump.edu.my/14487/6/fkm-2016-aisha-effect%20of%20flux.pdf |
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| Summary: | In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition. |
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