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Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint

Flip chip assembly, which is well known as controlled collapse chip connection (C4) has been widely used in semiconductor industry. Solder acts as a joining material in flip chip to interconnect chip with substrate, in order to provide electrical and mechanical continuity in assemblies. Since select...

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Bibliographic Details
Main Author: Zetty Akhtar, Abd Malek
Format: Thesis
Published: 2017
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://iportal.ump.edu.my/lib/item?id=chamo:101442&theme=UMP2
http://iportal.ump.edu.my/lib/item?id=chamo:101442&theme=UMP2
http://umpir.ump.edu.my/19733/1/Effect%20of%20nickel%20doping%20into%20solder%20alloy%20and%20its%20strength%20between%20SnCu-Niimmersion%20gold%20joint%20-Table%20of%20contents.pdf
http://umpir.ump.edu.my/19733/2/Effect%20of%20nickel%20doping%20into%20solder%20alloy%20and%20its%20strength%20between%20SnCu-Niimmersion%20gold%20joint%20-Abstract.pdf
http://umpir.ump.edu.my/19733/3/Effect%20of%20nickel%20doping%20into%20solder%20alloy%20and%20its%20strength%20between%20SnCu-Niimmersion%20gold%20joint%20-References.pdf
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