The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON Semicon...
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| Format: | Thesis |
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2004
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| Subjek-subjek: | |
| Capaian Atas Talian: | http://eprints.uthm.edu.my/1573/ http://eprints.uthm.edu.my/1573/1/24_Pages_from_THE_INVESTIGATION_ON_THE_FACTORS_THAT_AFFECT_THE_RESISTANCE_OF_DRAIN%2DTO%2DSOURCE_IN_SE.pdf |
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