Electrical and reliability performance of molded leadless package for high-voltage application
This paper investigates the influence on electrical and reliability performance of molded leadless package for high-voltage power integrated circuit (IC) application. Semiconductor devices are mostly encapsulated by using epoxy molding compounds which act as protection for the ICs from damage to the...
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| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/6846/ http://eprints.uthm.edu.my/6846/1/150.pdf |
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