Effect of nickel doping on interfacial reaction between lead-free solder and Ni-P substrate
Due to environmental concern, lead-free solder are taking the place of eutectic Sn-Pb solder in electronic packaging industry. Among various lead free alloys, Sn-Ag{u (SAC) alloys are leading lead-free candidate solders for various applications because it is offered better properties. This study inv...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/2430/ http://eprints.uthm.edu.my/2430/1/fkmp.pdf |
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