Heterogeneous stacking of 3D MPSoC architecture: physical implementation analysis and performance evaluation
3D integration is one of the feasible technologies for producing advanced computing architecture to support everincreasing demand of higher performance computing especially in mobile devices. The emerging trend of multiprocessor architecture has made Network on Chip (NoC) architecture the best solut...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/4271/ http://eprints.uthm.edu.my/4271/1/2C2%2D129.pdf |
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