Comparison between SAC405 lead-free solders and EN(P)EPIG and EN(B)EPIG surface finishes
In electronics industries, most of them had to shifted their solder materials from leaded solders into lead-free solders due to the environmental concerns and follow the legislation of Restriction of use Hazardous Substances (RoHS). Thus, Sn-Ag-Cu solder is one of the choices that can replace the le...
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| Pengarang-pengarang Utama: | , , , |
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| Format: | Conference or Workshop Item |
| Diterbitkan: |
2014
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| Subjek-subjek: | |
| Capaian Atas Talian: | http://eprints.uthm.edu.my/6378/ http://eprints.uthm.edu.my/6378/1/59.pdf |
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| Ringkasan: | In electronics industries, most of them had to shifted their solder materials from leaded
solders into lead-free solders due to the environmental concerns and follow the legislation of
Restriction of use Hazardous Substances (RoHS). Thus, Sn-Ag-Cu solder is one of the choices
that can replace the leaded solder and also offer better properties. This study investigates the
comparison between Sn-4.0Ag-0.5Cu (SAC405) and EN(P)EPIG and EN(B)EPIG surface finishes.
Reliability of solder joint has been assessed by performing solid state isothermal aging at 150ºC for
250 up to 2000 hours. After reflow soldering process, (Cu,Ni)6Sn5 intermetallic compound (IMC) is
dominated at near centre of solder meanwhile (Ni,Cu)3Sn4 IMC is dominated at near outside of
solder ball. Moreover, aging time resulted in an increase in thickness and changed the morphology
into more spherical, dense and large grain size. Analysis by optical microscope revealed that the
IMC thickness of EN(B)EPIG produced thicker IMC compared to EN(P)EPIG surface finish during
reflow as well as isothermal aging |
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