Damage mechanics model for solder/intermetallic interface fracture process in solder joint
The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fractu...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Scientific.Net
2011
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| Subjects: | |
| Online Access: | http://eprints.utm.my/44828/ http://eprints.utm.my/44828/ http://eprints.utm.my/44828/ |
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