Skip to content
VuFind
  • Your Account
  • Log Out
  • Login
  • Language
    • English
    • Malay
    • 中文(简体)
    • Tamil
Advanced
  • Interfacial reactions between...
  • Holdings
  • Cite this
  • Text this
  • Email this
  • Export Record
    • Export to RefWorks
    • Export to EndNoteWeb
    • Export to EndNote
  • Save to List
Cover Image
QR Code

Interfacial reactions between lead-free solders and electroless nickel

Saved in:
Bibliographic Details
Main Author: Mohd. Muzamir Mahat,
Format: Thesis
Published: 2009
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utm.my/48107/
Tags: Add Tag
No Tags, Be the first to tag this record!
  • Holdings
  • Description
  • Comments
  • Preview
  • Collection Items

Internet

http://eprints.utm.my/48107/

Similar Items

  • Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
    by: Ariff Syakirin, Ghazalli
    Published: (2007)
  • Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
    by: Boo, Nan Shing
    Published: (2010)
  • Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux / Muhammad Nasir
    by: Muhammad , Nasir
    Published: (2017)
  • Development of environmental friendly Electrical Conductive Adhesives (ECAS) as a replacement to lead based solder materials in electronic manufacturing industry
    by: Lam, Wai Man
    Published: (2011)
  • Substrate warpage analysis during solder reflow process
    by: Beh , Keh Shin
    Published: (2004)

Search Options

  • Search History
  • Advanced Search

Find More

  • Browse the Catalog
  • Browse Alphabetically
  • Explore Channels
  • NeuGuide
  • New Items

Need Help?

  • Search Tips
  • Ask a Librarian
  • FAQs
Loading...