Tin whiskers behaviour on immersion tin surface finish at high temperature and humidity condition
Towards green technology application in electronic industry, pure tin as a Pb-free component lead finish become a popular choice, yet facing the problem with tin whisker formation. Tin whisker has turned into a serious concern in the electronic industry where it may cause short circuit to electronic...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Conference or Workshop Item |
| Published: |
2015
|
| Subjects: | |
| Online Access: | http://eprints.utm.my/63538/ http://eprints.utm.my/63538/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|