Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Published: |
Universiti Malaysia Pahang
2013
|
| Subjects: | |
| Online Access: | http://dx.doi.org/10.15282/ijame.8.2013.22.0110 http://dx.doi.org/10.15282/ijame.8.2013.22.0110 http://umpir.ump.edu.my/10991/1/22_Azmah%20Hanim%20et%20al.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|