Effect of Isothermal Aging 2000 Hours on Intermetallics Formed Between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders
The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermet...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Trans Tech Publications, Switzerland
2013
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| Subjects: | |
| Online Access: | http://dx.doi.org/10.4028/www.scientific.net/AMR.650.194 http://dx.doi.org/10.4028/www.scientific.net/AMR.650.194 http://umpir.ump.edu.my/5200/1/AMR.650.194_from_kak_azmah_2013.pdf |
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