Effect of Isothermal Aging 2000 Hours on Intermetallics Formed Between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders
The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermet...
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| Main Authors: | , , , |
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| 格式: | Article |
| 出版: |
Trans Tech Publications, Switzerland
2013
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| 主题: | |
| 在线阅读: | http://dx.doi.org/10.4028/www.scientific.net/AMR.650.194 http://dx.doi.org/10.4028/www.scientific.net/AMR.650.194 http://umpir.ump.edu.my/5200/1/AMR.650.194_from_kak_azmah_2013.pdf |
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| 总结: | The present study investigated the effect of isothermal aging up to 2000 hours on the
intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless
palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of
changing the intermetallic morphology to coarser and dense structure. The intermetallic compound
formed for the interconnection of the lead free solder changes with increased aging time from
(Cu,Ni)6Sn5 compound to (Ni,Cu)3Sn4. At the end of the 2000 hours aging time, it changes to
Ni3Sn4. This is the effect of Cu element availability during the intermetallics growth process.
Starting from as reflow process, (Pd, Ni)Sn4 intermetallics formed near the interface of the solder
joint. The formation of the (Pd, Ni)Sn4 intermetallics act like a diffusion barrier to slow down the
growth of interface intermetallics. Lastly, Au element was detected in the Pd-Sn based intermetallic
after aging more than 1000 hours.
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