Effect of Reflow Soldering Profile on Intermetallic Compound Formation
Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic compound (IMC) formation a...
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| Pengarang-pengarang Utama: | , , , |
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| Format: | Artikel |
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Inderscience
2015
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| Subjek-subjek: | |
| Capaian Atas Talian: | http://dx.doi.org/10.1504/IJCAT.2015.073590 http://dx.doi.org/10.1504/IJCAT.2015.073590 http://umpir.ump.edu.my/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf http://umpir.ump.edu.my/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf |
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