Effect of Surface Finish on Intermetallic Compound Formation During Soldering With Ni-Doped Solders
Solder joint reliability is dependent on both thickness and morphology of the intermetallics that form and grow at the solder joint interface during soldering and subsequent thermal ageing and examining the morphology of these intermetallics is of great importance. The focus of this paper is to p...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Published: |
ECS -The Electrochemical Society
2011
|
| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/5203/ http://umpir.ump.edu.my/5203/1/Solid_State_Science_and_Technology_srai2011.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|