Effect of Surface Finish on Intermetallic Compound Formation During Soldering With Ni-Doped Solders
Solder joint reliability is dependent on both thickness and morphology of the intermetallics that form and grow at the solder joint interface during soldering and subsequent thermal ageing and examining the morphology of these intermetallics is of great importance. The focus of this paper is to p...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
ECS -The Electrochemical Society
2011
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/5203/ http://umpir.ump.edu.my/5203/1/Solid_State_Science_and_Technology_srai2011.pdf |
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| Summary: | Solder joint reliability is dependent on both thickness and morphology of the
intermetallics that form and grow at the solder joint interface during soldering and
subsequent thermal ageing and examining the morphology of these intermetallics is of
great importance. The focus of this paper is to present experimental results of a
comprehensive study of the interfacial reactions during soldering of Sn-Ag-Cu-Ni leadfree
solders on copper (Cu), immersion silver (ImAg), and electroless nickel/ immersion
gold (ENIG) surface finishes. Using scanning electron microscopy detailed a study of
the 3-D morphology and grain size of the intermetallics was conducted. The results
showed that when soldering on ENIG surface finish, several morphologies of
intermetallics with different grain sizes form at the solder joint interface compared to a
single intermetallic morphology that forms when soldering on copper and immersion
silver. An attempt was made to discuss the effect of several factors that may have an
influence on the type of morphology the intermetallics may grow into. The results
obtained in the present investigation also revealed that the technique of removing the
solder by deep etching to examine the morphology of intermetallics is a convenient and
efficient method to investigate the intermetallics formed at the solder joints
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