Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish
In electronic packaging industry, they are now driven technology to green product by replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can fulfill this re...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Published: |
Trans Tech Publications, Switzerland
2012
|
| Subjects: | |
| Online Access: | http://dx.doi.org/10.4028/www.scientific.net/AMR.415-417.1181 http://dx.doi.org/10.4028/www.scientific.net/AMR.415-417.1181 http://umpir.ump.edu.my/5202/1/AMR_from_kak_ija.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|