Microstructure Evaluation at the Solder Joint during Isothermal Aging
The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/8623/ http://umpir.ump.edu.my/8623/1/Microstructure_Evaluation_at_the_Solder_Joint_during_Isothermal_Aging.pdf |
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