Microstructure Evaluation at the Solder Joint during Isothermal Aging
The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic...
Saved in:
| Main Authors: | , , , |
|---|---|
| 格式: | Conference or Workshop Item |
| 出版: |
2014
|
| 主题: | |
| 在线阅读: | http://umpir.ump.edu.my/8623/ http://umpir.ump.edu.my/8623/1/Microstructure_Evaluation_at_the_Solder_Joint_during_Isothermal_Aging.pdf |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|