Development of vapor pressure in FR4-copper composite material during solder reflow process
This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite materia...
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| தலைமை எழà¯à®¤à¯à®¤à®¾à®³à®°à¯à®•ளà¯: | , , , , |
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| வடிவமà¯: | Book Section |
| வெளியீடபà¯à®ªà®Ÿà¯à®Ÿà®¤à¯: |
American Institute of Physics
2012
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| பகà¯à®¤à®¿à®•ளà¯: | |
| நிகழà¯à®¨à®¿à®²à¯ˆ அணà¯à®•லà¯: | http://eprints.utm.my/35239/ http://eprints.utm.my/35239/ http://eprints.utm.my/35239/ |
| கà¯à®±à®¿à®¯à¯€à®Ÿà¯à®•ளà¯: |
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