Effect of isothermal aging 2000 hours on intermetallics formed between ni-pd-au with sn-4ag-0.5cu solders
The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetall...
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| வடிவமà¯: | Conference or Workshop Item |
| வெளியீடபà¯à®ªà®Ÿà¯à®Ÿà®¤à¯: |
2013
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| நிகழà¯à®¨à®¿à®²à¯ˆ அணà¯à®•à®²à¯: | http://eprints.utm.my/51017/ http://eprints.utm.my/51017/ |
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