Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate
Due to environmental concern, lead-free solder are taking the place of eutectic Sn-Pb solder in electronic packaging industry. Among various lead free alloys, Sn–Ag–Cu (SAC) alloys are leading lead-free candidate solders for various applications because it is offered better properties. This study in...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Trans Tech Publications, Switzerland
2012
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| Subjects: | |
| Online Access: | http://dx.doi.org/10.4028/www.scientific.net/AMR.488-489.1375 http://dx.doi.org/10.4028/www.scientific.net/AMR.488-489.1375 http://umpir.ump.edu.my/5192/2/AMR.488-489.1375_from_kak_Ija_2012.pdf |
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