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Effect of Cooling Rate and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating

This paper presents a study on relationship of cooling rates towards the intermetallic compound (IMC) morphology. Cooling rate is an important parameter as it has significant effect towards the IMC microstructure formation that indirectly affects solders joint reliability. However,there is still ins...

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Bibliographic Details
Main Authors: Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
Format: Article
Published: Trans Tech Publications, Switzerland 2015
Subjects:
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
Online Access:http://www.scientific.net/AMM.695.352
http://www.scientific.net/AMM.695.352
http://umpir.ump.edu.my/5643/1/Effect%20of%20Cooling%20and%20Isothermal%20Aging%20on%20Microstructure%20Using%20Electroless%20Nickel%20%28Boron%29%20Plating.pdf
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http://www.scientific.net/AMM.695.352
http://www.scientific.net/AMM.695.352
http://umpir.ump.edu.my/5643/1/Effect%20of%20Cooling%20and%20Isothermal%20Aging%20on%20Microstructure%20Using%20Electroless%20Nickel%20%28Boron%29%20Plating.pdf

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