Effect of Cooling Rate and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating

This paper presents a study on relationship of cooling rates towards the intermetallic compound (IMC) morphology. Cooling rate is an important parameter as it has significant effect towards the IMC microstructure formation that indirectly affects solders joint reliability. However,there is still ins...

Penerangan Penuh

Disimpan dalam:
Butiran Bibliografi
Pengarang-pengarang Utama: Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
Format: Artikel
Diterbitkan: Trans Tech Publications, Switzerland 2015
Subjek-subjek:
Capaian Atas Talian:http://www.scientific.net/AMM.695.352
http://www.scientific.net/AMM.695.352
http://umpir.ump.edu.my/5643/1/Effect%20of%20Cooling%20and%20Isothermal%20Aging%20on%20Microstructure%20Using%20Electroless%20Nickel%20%28Boron%29%20Plating.pdf
Penanda-penanda: Tambah Penanda
Tiada Penanda, Jadilah orang pertama menanda rekod ini!