Effect of Cooling Rate and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
This paper presents a study on relationship of cooling rates towards the intermetallic compound (IMC) morphology. Cooling rate is an important parameter as it has significant effect towards the IMC microstructure formation that indirectly affects solders joint reliability. However,there is still ins...
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| Pengarang-pengarang Utama: | , , , |
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| Format: | Artikel |
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Trans Tech Publications, Switzerland
2015
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| Subjek-subjek: | |
| Capaian Atas Talian: | http://www.scientific.net/AMM.695.352 http://www.scientific.net/AMM.695.352 http://umpir.ump.edu.my/5643/1/Effect%20of%20Cooling%20and%20Isothermal%20Aging%20on%20Microstructure%20Using%20Electroless%20Nickel%20%28Boron%29%20Plating.pdf |
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