The development of new backside decapsualtion technique to investigate integrated circuit failure in the automotive application environment
The semiconductor industry is the aggregate collection of companies engaged in the design and fabrication of semiconductor devices. To establish the good company of semiconductor, the development of failure analysis organization must be made. Failure analysis is the process of collecting and analyzi...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Published: |
2015
|
| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/7577/ http://eprints.uthm.edu.my/7577/1/TUAN_MOHD_MUSTAQIM_BIN_TUAN_AHMAD.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | The semiconductor industry is the aggregate collection of companies engaged in
the design and fabrication of semiconductor devices. To establish the good company of
semiconductor, the development of failure analysis organization must be made. Failure
analysis is the process of collecting and analyzing data to determine the cause of
a failure. It is an important discipline in many branches of manufacturing industry, such
as the electronics industry, where it is a vital tool used in the development of new
products and for the improvement of existing products. The failure analysis process
relies on collecting failed components for subsequent examination of the cause or causes
of failure using a wide array of methods, especially microscopy and spectroscopy. This
project will discuss about the failure analysis step and procedure. The aim of this project
is to design a new backside decapsulation method in order to improve the failure
analysis processing time and root cause finding. This project contains of several parts
which are electrical analysis, IC decapsulation with chemical analysis and fault isolation
step. Comparison between the old method and new method result has been made and the
effectiveness of the sample has been measured by performing analysis on 20 samples.
The simulation and measurement results show 85.5% of improvement in term of failure
analysis processing time by comparing with old method. In term of root cause
identification, the root cause has been successfully identify for all samples which were
related to EOS, ESD and Wafer Fabrication related failure classified as Poly and GOX.
Based on this result, the success rate for 20 samples by using new backside
decapsulation technique is 100%. |
|---|