Vapor pressure development in a FR4-CU composite structure during solder reflow
This article presents a study on the development of vapor pressure a FR4-Cu composite structure when heated to a solder reflow temperature of 215 °C. Abaqus® finite element software was used to develop a representative two-dimensional model of the composite structure and to simulate moisture absorpt...
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| தலைமை எழà¯à®¤à¯à®¤à®¾à®³à®°à¯à®•à®³à¯: | , , |
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| வடிவமà¯: | Conference or Workshop Item |
| மொழி: | English |
| வெளியீடபà¯à®ªà®Ÿà¯à®Ÿà®¤à¯: |
2014
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| பகà¯à®¤à®¿à®•à®³à¯: | |
| நிகழà¯à®¨à®¿à®²à¯ˆ அணà¯à®•à®²à¯: | http://eprints.utm.my/61554/ http://eprints.utm.my/61554/1/NazriKamsah2014_VaporPressureDevelopmentinaFR4-CUCompositeStructure.pdf |
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