Vapor pressure development in a FR4-CU composite structure during solder reflow
This article presents a study on the development of vapor pressure a FR4-Cu composite structure when heated to a solder reflow temperature of 215 °C. Abaqus® finite element software was used to develop a representative two-dimensional model of the composite structure and to simulate moisture absorpt...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://eprints.utm.my/61554/ http://eprints.utm.my/61554/1/NazriKamsah2014_VaporPressureDevelopmentinaFR4-CUCompositeStructure.pdf |
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